Model: 853 ESD, PRE-HEATER FOR B.G.A. RE-WORK SYSTEM, Temp., Controlled

Features:

• 1. Rapid heating, only 10s to reach 250 ℃.
• 2. Built-in temperature sensor, stable output temperature.
• 3. Cool or hot air can be selected to pre-heat or cool chips.
• 4. The preheater can be used with rework stations to process BGA or other flake ICs.

Fixture for B.G.A Re-Work System which can hold PCBs for B.G.A Re-work.

• 850 Series S.M.D Re-work Stations/Systems can be connected at the top and 853 Pre-Heater can be placed below the PCB.
• Vacuum Pickup Model 381 A can be used to pickup/hold the components.

Fixture for B.G.A Re-Work System which can hold PCBs for B.G.A Re-work.

850 Series S.M.D Re-work Stations/Systems can be connected at the top and 853 PreHeater can be placed below the PCB. Vacuum Pickup Model 381 A can be used to

pickup/hold the components.

Specifications:

• Power 460 W
• Temperature range 120 ℃ ~ 250 ℃
• Air volume 0.18m3 / min.
• Dimensions 100 (L) x 60 (W) x 170 (H) mm
• Weight About 1.0 Kg. (including power cord)

Documentation:

• Datasheet