• Industrial HMI
  
• EV charging stations
• Touchless building access
• Driver monitoring systems

• AM623—IoT and gateway SoC with Arm® Cortex®-A53 based object and gesture recognition
  
• AM625—Human-Machine InteractionSoC with Arm® Cortex®-A53 based edge AI, full-HD dual-display

Features for the AM623

Processor Cores:

• Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4 GHz
  
• Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
• Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
• Single-core Arm® Cortex®-M4F MCU at up to 400 MHz
• 256KB SRAM with SECDED ECC
• Dedicated Device/Power Manager

Multimedia:

• Display subsystem
  
• Dual display support
• 1920x1080 @ 60fps for each display
• 1x 2048x1080 + 1x 1280x720
• Up to 165 MHz pixel clock support with Independent PLL for each display
• OLDI/LVDS (4 lanes - 2x) and 24-bit RGB parallel interface
• Support safety feature such as freeze frame detection and MISR data check
• 3D Graphics Processing Unit
• 1 pixel per clock or higher
• Fillrate greater than 500 Mpixels/sec
• >500 MTexels/s, >8 GFLOPs
• Supports at least 2 composition layers
• Supports up to 2048x1080 @60fps
• Supports ARGB32, RGB565 and YUV formats
• 2D graphics capable
• OpenGL ES 3.1, Vulkan 1.2
• One Camera Serial interface (CSI-Rx) - 4 Lane with DPHY
• MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
• Support for 1,2,3 or 4 data lane mode up to 2.5Gbps
• ECC verification/correction with CRC check + ECC on RAM
• Virtual Channel support (up to 16)
• Ability to write stream data directly to DDR via DMA

Memory Subsystem:

• Up to 816KB of On-chip RAM
  
• 64KB of On-chip RAM (OCSRAM) with SECDED ECC , Can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
• 256KB of On-chip RAM with SECDED ECC in SMS Subsystem
• 176KB of On-chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
• 256KB of On-chip RAM with SECDED ECC in Cortex-M4F MCU subsystem
• 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
• DDR Subsystem (DDRSS)
• Supports LPDDR4, DDR4 memory types
• 16-Bit data bus with inline ECC
• Supports speeds up to 1600 MT/s
• Max addressable range
• 8GBytes with DDR4
• 4GBytes with LPDDR4

Functional Safety:

• Functional Safety-Compliant targeted [Industrial]
  
• Developed for functional safety applications
• Documentation will be available to aid IEC 61508 functional safety system design
• Systematic capability up to SIL 3 targeted
• Hardware Integrity up to SIL 2 targeted
• Safety-related certification
• IEC 61508 by TUV SUD planned
• Functional Safety-Compliant targeted [Automotive]
• Developed for functional safety applications
• Documentation will be available to aid ISO 26262 functional safety system design
• Systematic capability up to ASIL D targeted
• Hardware integrity up to ASIL B targeted
• Safety-related certification
• ISO 26262 by TUV SUD planned
• AEC-Q100 qualified

Security:

• Hardware Security Module
  
• Dedicated dual-core Arm Cortex-M4F Security co-processor with 426KB RAM for key and security management, with dedicated device level interconnect for security
• Dedicated security DMA and IPC subsystem for isolated processing
• Secure boot supported
• Hardware-enforced Root-of-Trust (RoT)
• Support to switch RoT via backup key
• Support for takeover protection, IP protection, and anti-roll back protection
• Cryptographic acceleration supported
• Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
• Supports cryptographic cores
• AES – 128/192/256 Bits key sizes
• SHA2 – 224/256/384/512
• DRBG with true random number generator
• PKA (Public Key Accelerator) to Assist in RSA/ECC processing
• DMA support
• Debugging security
• Secure software controlled debug access
• Security aware debugging
• Trusted Execution Environment (TEE) supported
• Arm TrustZone based TEE
• Extensive firewall support for isolation
• Secure watchdog/timer/IPC
• Secure storage support
• On-the-Fly encryption support for OSPI interface in XIP mode

PRU Subsystem:

• Dual-core Programmable Real-Time Unit Subystem (PRUSS) running up to 333 MHz
  
• Intended for driving GPIO for cycle accurate protocols such as additional:
• General Purpose Input/Output (GPIO)
• UARTs
• I2C
• External ADC
• 16KByte program memory per PRU with SECDED ECC
• 8KB data memory per PRU with SECDED ECC
• 32KB general purpose memory with SECDED ECC
• CRC32/16 HW accelerator
• Scratch PAD memory with 3 banks of 30 x 32-bit registers
• 1 Industrial 64-bit timer with 9 capture and 16 compare events, along with slow and fast compensation
• 1 interrupt controller (INTC), minimum of 64 input events supported

High-Speed Interfaces:

• Integrated Ethernet switch supporting (total 2 external ports)
  
• RMII(10/100) or RGMII (10/100/1000)
• IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
• Clause 45 MDIO PHY management
• Packet Classifier based on ALE engine with 512 classifiers
• Priority based flow control
• Time sensitive networking (TSN) support
• Four CPU H/W interrupt Pacing
• IP/UDP/TCP checksum offload in hardware
• Two USB2.0 Ports
• Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
• Integrated USB VBUS detection
• Trace over USB supported

General Connectivity:

• 9x Universal Asynchronous Receiver-Transmitters (UART)
  
• 5x Serial Peripheral Interface (SPI) controllers
• 6x Inter-Integrated Circuit (I2C) ports
• 3x Multichannel Audio Serial Ports (McASP)
• Transmit and Receive Clocks up to 50 MHz
• Up to 16/10/6 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
• Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
• Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
• FIFO Buffers for Transmit and Receive (256 Bytes)
• Support for audio reference output clock
• 3x enhanced PWM modules (ePWM)
• 3x enhanced Quadrature Encoder Pulse modules (eQEP)
• 3x enhanced Capture modules (eCAP)
• General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
• 3x Controller Area Network (CAN) modules with CAN-FD support
• Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
• Full CAN FD support (up to 64 data bytes)
• Parity/ECC check for Message RAM
• Speed up to 8Mbps

Media and Data Storage:

• 3x Secure Digital (SD) (4b+4b+8b) interface
  
• 1x 8-bit eMMC interface up to HS200 speed
• 2x 4-bit SD/SDIO interface up to UHS-I
• Compliant with eMMC 5.1, SD 3.0 and SDIO Version 3.0
• 1× General-Purpose Memory Controller (GPMC) up to 133 MHz
• Flexible 8- and 16-Bit Asynchronous Memory Interface With up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
• Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
• Uses Hamming Code to Support 1-Bit ECC
• Error Locator Module (ELM)
• Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
• Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
• OSPI/QSPI with DDR / SDR support
• Support for Serial NAND and Serial NOR flash devices
• 4GBytes memory address support
• XIP mode with optional on-the-fly encryption

Power Management:

• Low power modes supported by Device/Power Manager
  
• Partial IO support for CAN/GPIO/UART wakeup
• DeepSleep
• MCU Only
• Standby
• Dynamic frequency scaling for Cortex-A53

Optimal Power Management Solution:

• Recommended TPS65219 Power Management ICs (PMIC)
  
• Companion PMIC specially designed to meet device power supply requirements
• Flexible mapping and factory programmed configurations to support different use cases

Boot Options:

• UART
  
• I2C EEPROM
• OSPI/QSPI Flash
• GPMC NOR/NAND Flash
• Serial NAND Flash
• SD Card
• eMMC
• USB (host) boot from Mass Storage device
• USB (device) boot from external host (DFU mode)
• Ethernet

Technology / Package:

• 16-nm technology
  
• 13 mm x 13 mm, 0.5-mm pitch, 425-pin FCCSP BGA (ALW)
• 17.2 mm x 17.2 mm, 0.8-mm pitch, 441-pin FCBGA (AMC) [Advance Information]

Documentation:

• Datasheet

Package Includes:

• 1 x AM6232ATCGGAALW Internet of Things (IoT) and gateway SoC with Arm Cortex -A53-based object and gesture recognition