These are high quality heat sink with conduction glue that can be used for dissipating the heat emitted by various memory, BGA & SoC's chips.

Specifications

Heat Sink - Aluminum with Glue

Dimensions

55) 14mm x 14mm x 5mm

56) 20mm x 20mm x 5mm

Qty

These high quality Heat sink can be used for dissipating the heat emitted by TO220 package device su..

रo 8.00

Helps disperse the heat from CPU to heatsink effectively. Specifications: Syr..

रo 25.00 रo 30.00

These are high quality heat sink with heat conduction glue that can be used for dissipating the heat..

रo 13.00

These are high quality heat sink with glue that can be used for dissipating the heat emitted by vari..

रo 12.00

Helps disperse the heat from CPU to heatsink effectively. Features and Specifications: ..

रo 240.00

This tiny little orange heatsink is a perfect solution for cooling off small surface-mount component..

रo 359.00 रo 413.00

..

रo 179.00 रo 213.00

This high quality, low profile, pure copper heatsink is a perfect solution for cooling off smal..

रo 66.00 रo 76.00