These are high quality heat sink with glue that can be used for dissipating the heat emitted by various memory, BGA & SoC's chips.
Specifications
- Material : Aluminum
- Size: 8mm(L) x 8mm(W) x 5mm(H)
Heat Sink - Aluminum with Glue (8mm)
- Product Code:PRC-Heat-Sink-AL-G-090905
- Reward Points:1
- Availability:In Stock
-
रo 12.00
- Price in reward points:12