The Qualcomm® Robotics RB5 platform is the most innovative platform bringing together Qualcomm Technologies broad expertise in 5G and AI to empower developers and manufacturers to create the next generation of high-compute, low-power robots and drones for the consumer, enterprise, defense, industrial and professional service sectors – and the comprehensive Qualcomm Robotics RB5 Development Kit helps ensure that developers have the customization and flexibility they need to make their visions a commercial reality. With 4G and 5G connectivity speeds via a companion module, the Qualcomm Robotics RB5 platform helps pave the way for the proliferation of 5G in robotics and intelligent systems.

The Qualcomm Robotics RB5 Platform supports the development of smart, power-efficient and cost-effective robots by combining high-performance heterogeneous compute, Qualcomm® Artificial Intelligence (AI) Engine for on-device machine learning, computer vision, vault-like security, multimedia, Wi-Fi and cellular connectivity solutions to help solve common robotics challenges.

Robotics RB5 Development Kit Applications

Service Robot
Industrial Robot/Control
Automated Guided Vehicle
Self-driving Vehicle for logistics
Consumption/Entertainment Robot
Industrial Drone

Robotics RB5 Development Kit Highlights

Advance Imaging capability

Gigapixel speed ISP powered by top of the line Qualcomm® Spectra™ 480 ISP with ability to process 2 Gigapixels per second. This Gigapixel speed delivers new camera features including 8K video recording, 7 camera concurrency, capture 200-megapixel photos, and simultaneously capture 4K HDR video and 64 MP (with zero shutter lag) photos.

On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine

The Qualcomm Robotics RB5 Platform supports the leading 5th generation Qualcomm AI Engine with the brand-new Qualcomm Hexagon™ Tensor Accelerator, pushing 15 trillion operations per second(TOPS) with maximum efficiency to run complex AI and deep learning workloads at the Edge.

Advanced connectivity

Qualcomm® FastConnect™ 6800 Subsystem with Wi-Fi 6 (802.11ax), 802.11ac Wave 2, 802.11a/b/g/n.
Support for 5G including 5G mmWave and sub-6 GHz based of Qualcomm® Snapdragon™ X55 5G Modem-RF System via a companion module. Using 5G technology mission critical and wide scale deployments with low end-to-end latency is possible.

Heterogenous computing with efficient power budgets

The Qualcomm Robotics RB5 platform provides powerful heterogeneous computing capabilities using the octa core Qualcomm® Kryo™ 585 CPU, powerful Qualcomm® Adreno™ 650 GPU, multiple DSPs (compute, audio, and sensor) and ISPs. The Qualcomm Robotics RB5 Platform is designed to support large industrial and enterprise robots as well as small battery-operated robots with challenging power and thermal dissipation requirements.

Flexible design options for commercialization

In addition to a feature packed development kit, the platform offers a range of solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.

Advance Security

Qualcomm® Secure Processing Unit (SPU) offers vault-like security providing Secure Boot, Hardware root of trust , cryptographic accelerators, Qualcomm® Trusted Execution Environment and camera security. Qualcomm® Crypto Engine Core is FIPS 140-2 certified.

High Resolution depth sensing

Robust depth sensing solution infused with an inertial measurement unit (IMU) using depth camera.

Tracking Camera

Perception and Navigation using Tracking Camera Sensor module to do visual simultaneous localization and mapping (vSLAM).

Engine for Video Analytics

Hardware acceleration for advance computer vision applications using the dedicated computer vision hardware block EVA (Engine for Video Analytics). EVA provides enhancements for CV applications with reduced latencies for real time image processing decisions under decreased power for demanding budgets freeing up the DSP, GPU, and CPU capacity for other critical AI applications.

Fast Time to commercialization

In addition to a feature packed software development tools and solutions, the platform offers solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.

Qualcomm® Sensing Hub

Qualcomm® Sensing Hub delivers scalable sensor framework at ultra low power supporting multiple sensors and 3rd party algorithms.

Comprehensive development kit

The kit includes the robotics-focused development board, compliant with the 96Boards open hardware specification for supporting a broad range of mezzanine-board expansions and range of sensor support like camera sensor, depth camera, time-of-flight, multi-mic support, GMSL sensor, Ultrasonic Time-of-Flight Sensor with Extended Range and support for additional sensors like IMU, pressure sensor etc.

Specifications:

Component		Qualcomm® Robotics RB5 Development Kit
SOM Platform		Qualcomm® QRB5165
		Qualcomm® Kryo™ 585
		Qualcomm® Adreno™ 650 GPU, Adreno™ 665 VPU, Adreno™ 995 DPU
		Qualcomm® Hexagon™ DSP with quad HVX
		Qualcomm® Spectra™ 480 image processing
Storage		128 GB UFS3.1 Onboard Storage
Storage		1 x MicroSD Card Slot
Ethernet		1 x 1GbE Ethernet
Wireless		WLAN 802.11a/b/g/n/ac/ax 2.4/5GHz 2x2 MIMO
Wireless		n-Board WLAN Antennas
USB		1 x USB 2.0 Micro B (Debug only)
		1 x USB 3.0 Type C (OTG Mode)
		2 x USB 3.0 Type A (Host Mode Only)
Display		1 x HDMI 1.4 (Type A - full) on Board Connector
Audio		2 x Class-D on Board Speaker Amplifier, WSA8810
Audio		1 x on Board PDM MIC on Mainboard, 4 x on Board PDM MIC on NAV MEZZ
Sensor		Accelerometer + Gyro Sensor (TDK ICM-42688/ ICM-42688-P) Barometric Pressure
Camera	Vision kit	IMX577 l * (only support in Qualcomm® Robotics RB5 Vision Kit.)
		GMSL l *
		OV9282 l * (only support in Qualcomm® Robotics RB5 Vision Kit.)
	Accessories	Nuvoton® (ToF) – Sensor[MN34906]
	Accessories	Intel® RealSense (D435i)
Expansion interfaces		Expansion connectors:
		HS1:1 x 60 pin high-speed connector (SDC I/F, 1 x 4L MIPI DSI, USB 2.0, CCI I2C x2, 2L+4L-MIPI CSI)
		HS2:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, SPI x 1, PCIe 3.0 gen3 1L, USB 3.0 x1, GPIO x 8)
		HS3:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, 4L-MIPI CSI x1(plus 2L CSI in HS1), RF CLK x 2, 2L-PCIe 3.0 x 1, 2L-PCIe 3.0 x 1(plus PCIe 1L in HS2), 4L-MIPI DSI x 1)
		LS1:1 x 40 pin low-speed connector (UART x 2, SPI, I2S/PCM, I2C x 2, GPIO x 12, DC powers)
		LS2:1 x 46 pin low-speed connector (Speaker x 2, DMIC I/F x 3, CAN, I2S, GPIOs, PWM, ADC, I2C, DC powers)
		LS3:1 x 46 pin low-Speed connector (SPI x 2, SSC I2C, sensor interrupt x 5, GPIOs, RTC clock, DC powers)
LED		7 x LED Indicators
		4 x User Controllable
		2 x For radios (WLAN activity)
		1 x Power indicator
Buttons		Power
		Volume Up/Down
		Force USB Boot
		Dip Switch x 2 (6pin+4pin)
Power source		12 V @2.5A adapter with a DC plug inner diameter 1.75mm and outer diameter 4.75mm
Size		85 mm x 54 mm meets the 96boards Hardware Specifications