These are high quality heat sink with heat conduction glue that can be used for dissipating the heat emitted by various memory, BGA & SoC's chips.
Specifications
- Material : Aluminum
- Size: 11mm(L) x 11mm(W) x 5mm(H)
Heat Sink - Aluminum with Glue (11mm)
- Product Code:PRC-Heat-Sink-AL-G-111105
- Reward Points:1
- Availability:Out Of Stock
-
रo 13.00
- Price in reward points:13
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Tags: Aluminum, Heat, Sink, Conduction, Gue