The Qualcomm RB3 Gen 2 development kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation.

• RB3 Gen 2 features support for Qualcomm® Linux®—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms.
• Utilizing the Qualcomm® QCS6490, the Qualcomm® RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data.
• The platform includes a development kit and software. Developers can select the development kit version that best addresses their needs, and design IoT products that demand advanced performance. The platform includes SDKs that make it easy for developers to use and integrate applications and services. The hardware development kit is also compliant with the 96Boards open hardware specification to support a range of mezzanine-board expansions, beginning with the Vision Mezzanine.

The platform includes the Qualcomm® Spectra™ ISP 570L image processing engine for the ultimate photography and videography experience, and comes with a main camera and tracking camera on the Vision Kit. It can connect to and process the output of other cameras such as stereo, depth, and Time-of-Flight (ToF). The Qualcomm® Adreno™ 633 VPU provides high-quality, UltraHD video encode and decode, while the Adreno 1075 DPU enables on-device and external UltraHD display support.

Multi-gigabit Wi-Fi 6E achieves blazing-fast wireless connectivity and low latency. Our Wi-Fi 6E offerings utilize advanced features like Qualcomm® 4K Quadrature Amplitude Modulation (QAM) and support for high-speed 160MHz channels for multi-gigabit-per-second speeds with superb stability and consistent experiences.

With the Qualcomm® Kryo™ 670 CPU and a Qualcomm® Hexagon™ processor featuring a fused AI-accelerator architecture, this solution delivers powerful connections and computing performance, and is purpose-built for industrial and commercial IoT applications such as ruggedized handhelds and tablets, human-machine interface systems, point-of-sale systems, drones, kiosks, edge AI boxes, and connected cameras.

Qualcomm® RB3 Gen 2 Development Kit Features:

• Advanced ISPs for single or multiple concurrent camera experience with superior image and video capture.
• AI-accelerated workplace security and visibility.
• Blazing-fast wireless connectivity and low latency thanks to multi-gigabit Wi-Fi 6E: Up to 3.6 Gbps, 160MHz, 4K QAM, DBS with MU-MIMO and OFDMA, and WPA3-P & E.
• Superior Bluetooth® 5.2 and LE audio with crystal-clear sound, low latency, and reliability with an extended range.
  
• Low-speed expansion for GPIOs, I2C, SPI, UART, and/or audio.
  
• High-speed expansion for PCIe, USB, MIPI CSI/DSI, and/or SDIO, designed for 96Boards mezzanines.

Qualcomm RB3 Gen 2 Development Kit Applications:

• Face Detection and Recognition
• Path Planning and 3D Map Formation
• Deep Learning
• vSLAM (Visual Localization and Mapping)
• Inventory Management
• Driver Management Systems
• Surveillance and Security
• Object Detection and Avoidance