The Qualcomm Robotics RB3 development kit supports the development of smart, power-efficient and cost-effective robots by combining high-performance heterogeneous computing, Qualcomm®Artificial Intelligence (AI) Engine for on-device machine learning, computer vision, vault-like security, multimedia and Wi-Fi and cellular connectivity (4G/LTE and CBRS). Comprised of a comprehensive set of software & hardware, including the industry’s best performing 6-Axis Motion Sensor (ICM-42688), Top Port PDM Microphone (ICS-41351), and Barometric Pressure Sensor (ICP-10101) from TDK InvenSense.The Qualcomm Robotics RB3 development kit is designed to help manufacturers and developers create robotic products ranging from large industrial and enterprise robots to small battery-operated one’s with challenging power and thermal dissipation requirements.

The Qualcomm Robotics RB3 development kit includes the purpose-built robotics-focused DragonBoard™ 845c development board, based on the Qualcomm® SDA845 processor and compliant with the 96Boards open hardware specification to support a broad range of mezzanine-board expansions.

The Qualcomm SDA845 processor is a heterogeneous computing architecture and integrates an Octa Core Qualcomm ® Kryo™ CPU with performance up to 2.8GHz a Qualcomm® Adreno™ 630 Visual Processing Subsystem (including GPU, VPU and DPU), and a Qualcomm ® Hexagon™ 685 DSP with Hexagon Vector Extensions (HVX) delivering sophisticated, on-device AI processing and mobile-optimized computer vision (CV) capabilities for perception, navigation and manipulation.

The development board supports Linux and Robotics Operating System (ROS), while also including support for the Qualcomm® Neural Processing software development kit (SDK) for advanced on-device AI, the Qualcomm ® Computer Vision Suite, the Qualcomm ® Hexagon DSP SDK, and AWS RoboMaker.

Applications:

• Service Robot
• Industrial Robot/Control
• Automated Guided Vehicle
• Self-driving Vehicle for logistics
• Consumption/Entertainment Robot
• Industrial Drone

On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine

• The Qualcomm Robotics RB5 Platform supports the leading 5th generation Qualcomm AI Engine with the brand-new Qualcomm Hexagon™ Tensor Accelerator, pushing 15 trillion operations per second(TOPS) with maximum efficiency to run complex AI and deep learning workloads at the Edge.

Power efficient and cost-effective

• The Qualcomm ® Robotics RB3 Platform is designed to support large industrial and enterpriseenterprise robot’s as well as small battery-operated robots with challenging power and thermal dissipation requirements.

Comprehensive development kit

• The kit includes the robotics-focused development board, compliant with the 96Boards open hardware specification for supporting a broad range of mezzanine-board expansions and range of sensor support like camera sensor, depth camera, time-of-flight, multi-mic support, GMSL sensor, Ultrasonic Time-of-Flight Sensor with Extended Range and support for additional sensors like IMU, pressure sensor etc.

Flexible design options for commercialization

• In addition to a feature packed development kit, the platform offers a range of solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.

High Resolution depth sensing

• Robust depth sensing solution infused with an inertial measurement unit (IMU) using depth camera.

Time-of-Flight (ToF) camera:

• Time-of-flight for gestures and hand tracking use cases

Tracking Camera

• Perception and Navigation using Tracking Camera Sensor module to do visual simultaneous localization and mapping (vSLAM).

Advanced security

• Qualcomm Secure Processing Unit, hardware root of trust, trusted execution environment, secure boot, camera security

Sensor Core

• Support for multiple sensors and 3rd party algorithms through Sensor Software Framework

Connectivity

• Wi-Fi integrated 802.11ac 2x2 with MU-MIMO and support for cellular mezzanines for LTE and CBRS

Specification:

• CPU: SDA845 8x Kryo 385 CPU, up to 2.8 GHz
• GPU: Qualcomm Adreno™ 630 GPU with support for Open GL ES 3.2 and Open CL 2.0
• DSP: Qualcomm Hexagon™ 685 DSP with 3rd Gen Vector Extensions
• ISP: Qualcomm Spectra™ 280 Image Signal Processor with new architecture for 14-bit image signal processing
• RAM: 4GB LPDDR4x SDRAM @ 1866 MHz
• Memory: LPDDR4x, 4x16 bit; up to 1866MHz, 4GB RAM
• Storage: 64GB UFS 2.1 on-board storage and 1 x MicroSD card slot
• Ethernet: 1x GbE Ethernet
• Wireless: Wi-Fi integrated 802.11ac 2x2 with MU-MIMO; Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS).
• Location: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
• USB:
• 1 x USB 2.0 Micro B (Debug only)
• 1 x USB 3.0 Type C (OTG mode)
• 2x USB 3.0 Type A (Host mode only)
• Display:
• Two 4-lane DSI, D-PHY 1.2 or C-PHY 1.0; VESA DSC 1.1
• 1 x HDMI 1.4 (Type A - full) connector
• Video: Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut; H.264 (AVC), H.265 (HEVC) and VP9 support; Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
• Audio: MP3; aacPlus, eAAC; WMA 9/Pro
• Camera: Single HFR 16 MPix camera at 60fps ZSL, Dual 16 MPix cameras at 30fps ZSL, Single 32 MPix camera at 30fps ZSL
• Sensor: ICM-42688 6-Axis High Performance Motion Sensor, ICS-41351 Top Port Digital Microphone, and ICP-10101 Barometric Pressure Sensor from TDK InvenSense.
• Expansion Interfaces: 2 x 60 pin High-Speed connectors , 2 x 40 pin Low-Speed connectors, 1 x 20 pin Low-Speed connector
• LED: 7 x LED indicators
• Button: Power ,Volume Up/Down,Force Usb Boot, DIP Switch
• Power Source: [email protected] adapter with a DC plug
• OS Support: LE
• Size: 85mm by 54 mm

Specialized Solutions:

• Software Support for Linux and Robot Operating System (ROS)
• Qualcomm® Neural Processing SDK: optimizing deep learning processing performance across available resources to achieve superior edge computing experience.
• Qualcomm FastCV Computer Vision SDK: Offers a mobile-optimized computer vision (CV) library which enables new user experiences like gesture recognition, face detection, tracking and recognition, text recognition and tracking and augmented reality.
• Qualcomm® Hexagon DSP SDK: The Hexagon™ SDK is designed to optimize the features and performance of multimedia software.
• Qualcomm® Secure Processing Unit (SPU) offers vault-like security that safeguards your facial data, iris scan and other biometric data.

Documentation:

• Documents

Package Includes:

• Robotics DragonBoard™ 845c development board featuring Qualcomm® SDA/SDM845 processor and compliant with the 96Boards open hardware specification
• Qualcomm Robotics navigation mezzanine featuring time-of-flight, tracking camera, active stereo camera and main camera, which is compliant with 96Boards open hardware specification
• Sensor support including the industry’s best performing ICM-42688 6-Axis High Performance Motion Sensor, ICS-41351 Top Port Digital Microphone, and ICP-10101 Barometric Pressure Sensor from TDK InvenSense
• Qualcomm Robotics cellular mezzanine (optional)
• Multi-Mic support
• Power supply